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Manufacturing of Wafer-scale 3D Piezoelectric-on-Silicon Structures (09 GB 77dz 3F3W)
A UK company is instrumental in the technology necessary for the development of piezo devices directly driven by silicon. Using the current developments in 3D silicon-on-silicon devices as a starting point, the company has developed the state of art of the manufacturing processes that will be required, and identified possible sources of future process developments. They now wish to find partners to utilise this expertise and engage on a range of collaborative products.
Country: United Kingdom
Type: OFFER
Date: 09.10.2009
Multilayer wafer-scale packaging is becoming attractive as wafers get bigger and intermediate package costs, such as for ball graid array (BGA), micro BGA, and Quad Flat no-leads (QFN) increase.
Consideration now has to be given to the key parameters for dicing, grinding and other associated processes that will be required as the wafer-scale packaging process moves beyong pure silicone structures to components that include sensors and actuators, typically in the forms of MEMS and piezoelectric devices.
Key manufacturing technologies need to be considered to ensure the development of wafer stacking technology is successful. These include through-silicon vias, interposer manufacture, grinding with chemical mechanical polishing (CMP) and dicing. The type of material in the package may mean major changes or developement in the current procedures. The company have developed this expertise and are looking for partners for further development and utilisation of this technology.
Innovative Aspects:
The company offers partnership, development and technology collaboration opportunites utilising their 40-year experience in process development, machine production and research.
The increasing development of 3D packages raises issues of wafer size, thickness and no of layers raises production issues that the company can overcome bringing benefits of efficiency and scale.
The companies advanced technology and research facilities allow them to develop test and perfect efficient manufacturing solutions for new development challenges.
Degree of development:
Patents/Rights: Secret know-how
Requested Cooperation: Change in the partner sought's currently used technologies (installations, process, facilities), Absolutely novel process, Assembly, Engineering, Technical consultancy, Quality control, Maintenance, Joint further development, Testing of new applications, Adaptation to specific needs, Joint Venture Agreement, New way to use an existing production line, Transfer of knowledge in new raw materials
The company is looking to meet with companies or institutions that are developing technologies using silcon wafers or development of new process for the design, development and production of components requiring micro engineering.
Type of Organisation:
Status: NEW
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