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Development of the strongest possible adhesive bond to silicon and the commonly used top surface of a completed micro chip (09 NL 60AH 3FV1)
A Dutch SME company is looking for a research cooperation to improve bond strength tests for semiconductor industry. A common test is to measure the pull-strength of a silicon chip bound to a substrate. This test often fails because the bond being tested is stronger than the bond made to test it. There is therefore a need to improve the strength of the test bond and to maximise the capability of the test. A research programme is requested to find the strongest bond that can be made to silicon.
Country: Netherlands
Type: REQUEST
Date: 08.01.2010
To research/develop the strongest adhesive bond that can be made between any material with a higher yield strength than silicon to silicon.
The involved Dutch SME is a manufacturer of bond strength testers for the semiconductor industry. A common test is to measure the pull-strength of a silicon chip bound to a substrate (tested bond). This is currently achieved by making a stronger bond to the other side of the chip (test bond) so that it can be griped and tested. The test often fails because the bond being tested is stronger than the bond made to test it. There is therefore a need to improve the strength of the test bond and to maximise the capability of the test. A research programme is requested to find the strongest bond that can be made to silicon. In addition to this the bond to the substrate is on the silicon underside of a chip. The test bond is often made to a test piece of silicone but sometimes to a completed chip. In this case the test bond has to be made to the top surface of a chip and to the many forms that this may take.
Technical Specifications / Specific technical requirements:
Glue/adhere opposite sides of a silicon plate (chip nominally 10mm square x 1mm thick) with the adhesive under test to two pieces of material such that the material may be griped and the bonds can be pull tested. Typical testforces for a 10mm square sample are likely to be up to 2000N. The material used to grip and test the sample is also under test. A testmatrix of different adhesives and different materials should be made and completed with the strengths measured.
The combination of adhesive and material with the strongest test result will represent the conclusion for the research. Unless every adhesive known and every material known is tested we cannot be sure if this combination is indeed the best. This is not practical but it is hoped that the testmatrix is constructed by someone experienced in the field and thereby the result should be close to optimum.
Measure the bond strength (N/mm2) for a selected range of adhesives and materials to establish the maximum bond strength possible to silicon. Repeat this test with a range of chip components to maximise the test bond made to the commonly used range of chip structures and surface finishes.
Degree of development:
Patents/Rights:
Requested Cooperation: Joint further development, Testing of new applications, Adaptation to specific needs
- Type of partner sought: preferably university or research institute. But commercial companies are also invited to response.
- Specific area of activity of the partner: material properties and testing
- Task to be performed by the partner sought: material and adhesive research and testing
Type of Organisation:
Status: NEW
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