The development in the semiconductor industry is determined by the ability to reduce the size of semiconductor components. As semiconductor components get smaller and faster, the copper interconnects transferring data in and out of the microprocessors are reaching their physical limits. At smaller scales, copper interconnects fail to comply with faster data transfer rates due to the increased current and temperature stress. Internal heat generation leads to fast degradation of performance as well as shorter life of components.
The company develops and produces carbon nano structure that can be implemented in processes for manufacturing of conductive carbon nanofibers, in semiconductor interconnects, thermal management solutions and replacement of complex backside metallizations. The proprietary conductive nano-scale carbon technology solution reduces cost and increases performance of integrated circuit interconnects.
The excellent electrical and thermal connectivity provided with this nano-scale carbon technology solution contributes to a significantly higher current density compared to metals, and the precise growth control is providing unique design opportunities. These features has proven essential to support today's and future semiconductor technology nodes, i. e. further miniaturization of semiconductor circuits and packages.
Innovative Aspects:
The technology offered supports design and production of electronic chips current and future technology nodes - and has many advantages for several applications:
" General
- Electrically and Thermally conductive Lead Free material/process" 3D Interconnects
- High definition Bump pitch (down to sub-micron)
- Withstands extreme current density compared to metals" Backside Metallization
- Replaces complex metallization processes
- Excellent Electrical and Thermal conductivity" Thermal Management Solution
- For integration as a Heat Dissipater in semiconductor packages
